The high hardness, high strength and brittleness of ceramic materials make ceramic processing difficult. As a flexible, efficient and high-yield processing method, laser has demonstrated extraordinary capabilities in the processing of ceramic plates.
Due to the large sintering shrinkage rate, the accuracy of the size of the ceramic body after sintering cannot be guaranteed, and various holes, grooves and edges for assembly cannot be accurately reserved, so reprocessing is required after sintering. The non-contact processing method of laser cutting makes the product stress-free, the cutting edge has a small amount of edge collapse, high precision, and high processing yield, which is very suitable for ceramics, which are both hard and brittle materials.
At present, laser processing equipment for ceramic circuit boards is mainly used for cutting and drilling. Since laser cutting technology has many technical advantages, it has been widely used in the precision cutting industry. Advantages and analysis of ceramic substrates in laser processing Ceramic materials have good high-frequency electrical properties, high thermal conductivity, chemical stability and thermal stability, and are ideal packaging materials for the production of large integrated circuits and power electronic modules.
Laser processing of ceramic substrates is an important application technology in the microelectronics industry. This method is efficient, fast, accurate and has high application value. The following are the advantages of laser processing of ceramic substrates:
1. The cutting gap is narrow and materials are saved;
2. The laser spot is small, the energy density is high, the cutting quality is good, and the cutting speed is fast;
3. The laser processing is fine, and the cutting surface is smooth and burr-free;
4. The heat-affected zone is small. Compared with glass fiber boards, ceramic substrates are easy to break and have higher requirements for process technology, so laser drilling is often used. It has the characteristics of precision, speed and effici
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